Thermal management issues can come about through the minimal contact areas that arise between the two surfaces (interface) due to micro-scale surface roughness. This reduces heat conduction across the interface as air gaps have low thermal conductivity. Surface irregularity is the primary cause of thermal contact resistance. This product will increase contact between the two surfaces and decrease thermal interface resistance.

KULR’s Fiber Thermal Interface (FTI) is a carbon-fiber-based thermal interface material designed to enhance heat transfer in demanding applications. Featuring a unique velvet architecture, it combines the thermal and mechanical benefits of carbon fiber in a highly porous, lightweight structure that can be customized with different fiber types, lengths, substrates, and binders. With a density of less than 0.7 g/cm³ and low contact pressure, FTI achieves low thermal impedance while its high bond thickness reduces overall manufacturing costs. Used for decades in military and civilian aerospace applications, this high-performance, flexible material is also ideal for the automotive, electronics, and industrial sectors. By increasing power densities in board layouts and relieving mechanical stress, FTI enhances thermal stability and reliability, making it a versatile solution for a wide range of thermal management challenges.